TSMC August Revenue Reaches Record $16.35B Amid AI Demand

Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Thursday that its revenue for August reached a record high, a figure the company linked to continued demand for chips used in artificial intelligence. The world’s largest contract chipmaker reported monthly revenue of 514.8 billion New Taiwan dollars ($16.35 billion), an increase of 53.3 percent from the same period last year and 10.1 percent from July.

The August figures represent the fourth consecutive month of revenue growth for the company. During its second-quarter earnings call in July, TSMC executives described demand related to AI as “extremely robust.” For that quarter, the company reported a year-over-year profit increase of more than 77 percent and provided a third-quarter revenue forecast between $44.6 billion and $45.8 billion.

Prior to the release of the August revenue data, shares of TSMC closed down 0.61 percent in Thursday’s trading.

According to a report released Wednesday by the market research firm TrendForce, TSMC held a 72.5 percent share of the global foundry market in the second quarter. The report identified demand for processors used in AI servers as a key factor, keeping the company’s advanced 5-nanometer, 4-nanometer, and 3-nanometer production capacity fully utilized.

The same report listed Samsung Foundry as the second-largest manufacturer with a 5.9 percent market share, followed by China’s SMIC with 5.4 percent. The TrendForce data also showed that the world’s top ten foundries achieved a record combined revenue of nearly $53.49 billion in the second quarter, attributing this partly to supply constraints for advanced processes essential for AI and high-performance computing processors.

In a separate development this week, TSMC and Dutch semiconductor equipment manufacturer ASML announced a joint initiative focused on next-generation chipmaking technology. In the announcement, TSMC stated its plan to integrate ASML’s High NA (High Numerical Aperture) technology into its large-scale manufacturing processes for advanced nodes beginning in 2030.